Rework techniques process evaluation for chip scale packages
In: IEEE Transactions on Electronics Packaging Manufacturing, Jg. 23 (2000-07-01), Heft 3, S. 200-207
Online
academicJournal
Zugriff:
Titel: |
Rework techniques process evaluation for chip scale packages
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Autor/in / Beteiligte Person: | Nguty, T.A. ; Philpott, J.D. ; Ekere, N.N. ; Teckle, S. ; Salam, B. ; Rajkumar, D. |
Link: | |
Zeitschrift: | IEEE Transactions on Electronics Packaging Manufacturing, Jg. 23 (2000-07-01), Heft 3, S. 200-207 |
Veröffentlichung: | 2000 |
Medientyp: | academicJournal |
ISSN: | 1521-334X (print) ; 1558-0822 (print) |
DOI: | 10.1109/6104.873248 |
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