Fast 3D tomography at package level by using Xe plasma focused ion beam
In: 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA); (2013-07-01) S. 112-115
Online
Konferenz
Zugriff:
Titel: |
Fast 3D tomography at package level by using Xe plasma focused ion beam
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Autor/in / Beteiligte Person: | Hrncir, T. ; Hladik, L. ; Zadrazil, M. |
Link: | |
Quelle: | 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA); (2013-07-01) S. 112-115 |
Veröffentlichung: | 2013 |
Medientyp: | Konferenz |
ISBN: | 978-1-4799-1241-4 (print) ; 978-1-4799-0480-8 (print) |
ISSN: | 1946-1542 (print) ; 1946-1550 (print) |
DOI: | 10.1109/IPFA.2013.6599137 |
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