Novel Single and Co-Ion Implantation Induced Backside Etch Stop Structures for 3D Multilayer Stacked Package
In: IEEE 74th Electronic Components and Technology Conference (ECTC); (2024-05-28) S. 2184-2188
Online
Konferenz
Zugriff:
Titel: |
Novel Single and Co-Ion Implantation Induced Backside Etch Stop Structures for 3D Multilayer Stacked Package
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Autor/in / Beteiligte Person: | Chen, Yen-Shuo ; Chiu, Tzu-Wei ; Fan, Hua-Tai ; Ko, Yu-Chien ; Chen, Chu-Chi ; Ko, Fu-Hsiang |
Link: | |
Quelle: | IEEE 74th Electronic Components and Technology Conference (ECTC); (2024-05-28) S. 2184-2188 |
Veröffentlichung: | 2024 |
Medientyp: | Konferenz |
ISBN: | 979-8-3503-7598-5 (print) |
ISSN: | 2377-5726 (print) |
DOI: | 10.1109/ECTC51529.2024.00371 |
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