AIT licenses LSI's flip-chip BGA technology.
In: EBN, 2001-11-12, Heft 1288, S. 50-50
serialPeriodical
Zugriff:
Reports on Advanced Interconnect Technologies' (AIT) agreement to license organic laminate flip-chip ball grid array (BGA) technology from LSI Logic Corp. Enabling of AIT to help meet its customers' needs for packages with more leads and improved electrical and thermal performance; Offer of faster and more local testing of integrated circuits.
Titel: |
AIT licenses LSI's flip-chip BGA technology.
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Autor/in / Beteiligte Person: | Chin, Spencer |
Zeitschrift: | EBN, 2001-11-12, Heft 1288, S. 50-50 |
Veröffentlichung: | 2001 |
Medientyp: | serialPeriodical |
ISSN: | 0164-6362 (print) |
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