Underfill Effects on BGA Drop, Bend, and Thermal Cycle Tests.
In: Advanced Packaging, Jg. 14 (2005-02-01), Heft 2, S. 28-30
Online
serialPeriodical
Zugriff:
Discusses the effects of ball grid arrays underfill encapsulation on joint performance under drop and bend tests and thermal cycling. Analysis of relative solder joint reliability and failure modes; Dye penetration test and cross sectioning of solder joints; Ways to enhance thermal cycle performance.
Titel: |
Underfill Effects on BGA Drop, Bend, and Thermal Cycle Tests.
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Autor/in / Beteiligte Person: | Ibe, Edward ; Loh, Karl ; Luan, Jing-En ; Tong Yan Tee |
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Zeitschrift: | Advanced Packaging, Jg. 14 (2005-02-01), Heft 2, S. 28-30 |
Veröffentlichung: | 2005 |
Medientyp: | serialPeriodical |
ISSN: | 1065-0555 (print) |
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