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Weniger Treffer
Art der Quelle
Thema
- ball grid array technology 149 Treffer
- components, circuits, devices and systems 123 Treffer
- engineered materials, dielectrics and plasmas 76 Treffer
- solder & soldering 75 Treffer
- electronic packaging 60 Treffer
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45 weitere Werte:
- electronics packaging 53 Treffer
- soldering 52 Treffer
- photonics and electrooptics 43 Treffer
- electronic circuits 38 Treffer
- integrated circuits 36 Treffer
- packaging 35 Treffer
- electronic equipment 34 Treffer
- assembly 33 Treffer
- ball grid array (bga) 32 Treffer
- circuit testing 29 Treffer
- integrated circuit interconnections 27 Treffer
- surface mount technology 26 Treffer
- computing and processing 25 Treffer
- routing 25 Treffer
- electric circuits 24 Treffer
- chip scale packaging 21 Treffer
- microelectronics 21 Treffer
- manufacturing processes 20 Treffer
- pins 20 Treffer
- solder joints 20 Treffer
- copper 17 Treffer
- costs 17 Treffer
- lead 16 Treffer
- solder pastes 16 Treffer
- communication, networking and broadcast technologies 15 Treffer
- impedance 15 Treffer
- signal processing and analysis 15 Treffer
- temperature 15 Treffer
- fatigue 14 Treffer
- flip chip 14 Treffer
- sealing (technology) 14 Treffer
- electronic circuit design 13 Treffer
- general topics for engineers 13 Treffer
- bonding 12 Treffer
- electronic packaging thermal management 12 Treffer
- electronics 12 Treffer
- finite element method 12 Treffer
- capacitors 11 Treffer
- electric shock 11 Treffer
- fields, waves and electromagnetics 11 Treffer
- finite element analysis 11 Treffer
- integrated circuit packaging 11 Treffer
- miniature electronic equipment 11 Treffer
- printed circuits industry 11 Treffer
- integrated circuit modeling 10 Treffer
Verlag
- ieee 168 Treffer
- up media group, inc. 99 Treffer
- br publishing 22 Treffer
- endeavor business media 16 Treffer
- emerald publishing limited 15 Treffer
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25 weitere Werte:
- elsevier b.v. 14 Treffer
- springer nature 12 Treffer
- aspencore 9 Treffer
- metropolis international group ltd. 9 Treffer
- american institute of physics 8 Treffer
- clarion events, inc 5 Treffer
- wiley-blackwell 4 Treffer
- annex publishing & printing inc. 3 Treffer
- mdpi 3 Treffer
- sandia national laboratories 3 Treffer
- united business media 3 Treffer
- acm 2 Treffer
- american society of mechanical engineers 2 Treffer
- bnp media 2 Treffer
- electromagnetics academy 2 Treffer
- gruppo italiano frattura 2 Treffer
- taylor & francis ltd 2 Treffer
- edaa 1 Treffer
- emerald group publishing limited 1 Treffer
- european microwave association 1 Treffer
- institute of electrical and electronics engineers inc. 1 Treffer
- international information & engineering technology association (iieta) 1 Treffer
- international microelectronics & packaging society 1 Treffer
- questex media group 1 Treffer
- scholars' mine 1 Treffer
Publikation
- circuits assembly 39 Treffer
- printed circuit design & manufacture 36 Treffer
- smt: surface mount technology 22 Treffer
- ieee transactions on advanced packaging 19 Treffer
- electronic design 16 Treffer
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45 weitere Werte:
- printed circuit design & fab: circuits assembly 12 Treffer
- edn 9 Treffer
- electronics weekly 9 Treffer
- printed circuit design 9 Treffer
- aip conference proceedings 8 Treffer
- soldering & surface mount technology 8 Treffer
- ieee transactions on components, packaging & manufacturing technology 7 Treffer
- microelectronics reliability 7 Treffer
- circuit world 6 Treffer
- ieee transactions on advanced packaging, advanced packaging, ieee transactions on, ieee trans. adv. packag. 5 Treffer
- 1995 proceedings. 45th electronic components and technology conference, electronic components and technology conference, 1995. proceedings., 45th, electronic components and technology 4 Treffer
- 2000 proceedings. 50th electronic components and technology conference (cat. no.00ch37070), electronic components & technology conference, 2000. 2000 proceedings. 50th, electronic components and technology 4 Treffer
- 2005 7th electronic packaging technology conference, electronic packaging technology conference, 2005. eptc 2005. proceedings of 7th, electronics packaging technology 4 Treffer
- 2023 ieee 73rd electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2023 ieee 73rd, ectc 4 Treffer
- 56th electronic components and technology conference 2006, electronic components and technology conference, 2006. proceedings. 56th, electronic components & technology 4 Treffer
- ieee transactions on antennas & propagation 4 Treffer
- ieee transactions on computer-aided design of integrated circuits & systems 4 Treffer
- ieee transactions on electromagnetic compatibility 4 Treffer
- 2004 proceedings. 54th electronic components and technology conference (ieee cat. no.04ch37546), electronic components and technology conference, 2004. proceedings. 54th, electronic components and technology 3 Treffer
- advanced packaging 3 Treffer
- canadian electronics 3 Treffer
- electronic engineering times (01921541) 3 Treffer
- ieee transactions on components and packaging technologies, components and packaging technologies, ieee transactions on, ieee trans. comp. packag. technol. 3 Treffer
- ieee transactions on microwave theory & techniques 3 Treffer
- ieee/cpmt/semi 28th international electronics manufacturing technology symposium, 2003. iemt 2003., electronics manufacturing technology symposium, 2003. iemt 2003. ieee/cpmt/semi 28th international, electronics manufacturing technology 3 Treffer
- pc fab 3 Treffer
- 1996 proceedings 46th electronic components and technology conference, electronic components and technology conference, 1996. proceedings., 46th, electronic components and technology 2 Treffer
- 2006 11th international symposium on advanced packaging materials: processes, properties and interface, advanced packaging materials: processes, properties and interface, 200611th international symposium on 2 Treffer
- 2008 10th electronics packaging technology conference, electronics packaging technology conference, 2008. eptc 2008. 10th 2 Treffer
- 2008 58th electronic components and technology conference, electronic components and technology conference, 2008. ectc 2008. 58th 2 Treffer
- arabian journal for science & engineering (springer science & business media b.v. ) 2 Treffer
- composites: part a, applied science & manufacturing 2 Treffer
- connector specifier 2 Treffer
- electrical engineering in japan 2 Treffer
- fracture & structural integrity / frattura ed integrita strutturale 2 Treffer
- journal of electromagnetic waves & applications 2 Treffer
- journal of electronic packaging 2 Treffer
- materials (1996-1944) 2 Treffer
- microelectronics international 2 Treffer
- microsystem technologies 2 Treffer
- scientific reports 2 Treffer
- strain 2 Treffer
- electrical and computer engineering faculty research & creative works 1 Treffer
- other information: pbd: feb 1997 1 Treffer
- proceedings of the electronic packaging technology conference, eptc 1 Treffer
Sprache
Inhaltsanbieter
421 Treffer
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In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021-09-14, S. 1-5Online KonferenzZugriff:
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In: 2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME), 2016-10-01, S. 74-77Online KonferenzZugriff:
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In: IEEE Transactions on Advanced Packaging, Jg. 27 (2004-11-01), Heft 4, S. 630-639Online academicJournalZugriff:
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In: 2014 15th International Conference on Electronic Packaging Technology, 2014-05-01, S. 796-800Online KonferenzZugriff:
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In: IEEE Microwave and Wireless Components Letters, Jg. 18 (2008), Heft 1, S. 34-36Online academicJournalZugriff:
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In: 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010-06-01, S. 182-187Online KonferenzZugriff:
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In: Microsystem Technologies, Jg. 29 (2023-11-01), Heft 11, S. 1651-1658academicJournalZugriff:
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In: Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971), 2004, S. 149-153Online KonferenzZugriff:
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In: 4th Electronics Packaging Technology Conference,, 2002, S. 206-211Online KonferenzZugriff:
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In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543), Jg. 2 (2004), S. 343-349Online KonferenzZugriff:
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In: 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000, S. 914-919Online KonferenzZugriff:
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In: Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000, S. 391-397Online KonferenzZugriff:
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In: IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT, 2003, S. 17-21Online KonferenzZugriff:
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In: 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000, S. 449-453Online KonferenzZugriff:
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In: 53rd Electronic Components and Technology Conference,, 2003, S. 870-874Online KonferenzZugriff:
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In: 1996 Proceedings 46th Electronic Components and Technology Conference, 1996, S. 460-466Online KonferenzZugriff:
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In: IEEE Transactions on Components and Packaging Technologies, Jg. 29 (2006-09-01), Heft 3, S. 464-474Online academicJournalZugriff:
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In: 1995 Proceedings. 45th Electronic Components and Technology Conference, 1995, S. 78-85Online KonferenzZugriff:
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In: Proceedings. 1998 IEEE Symposium on IC/Package Design Integration (Cat. No.98CB36211), 1998, S. 120-123Online KonferenzZugriff:
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In: 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000, S. 944-947Online KonferenzZugriff: