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Weniger Treffer
Art der Quelle
Thema
- components, circuits, devices and systems 354 Treffer
- engineered materials, dielectrics and plasmas 185 Treffer
- computing and processing 176 Treffer
- communication, networking and broadcast technologies 172 Treffer
- photonics and electrooptics 153 Treffer
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45 weitere Werte:
- robotics and control systems 148 Treffer
- signal processing and analysis 123 Treffer
- soldering 109 Treffer
- fields, waves and electromagnetics 106 Treffer
- aerospace 98 Treffer
- transportation 85 Treffer
- bioengineering 63 Treffer
- reliability 57 Treffer
- electronics packaging 56 Treffer
- general topics for engineers 53 Treffer
- bga 41 Treffer
- lead 41 Treffer
- engineering profession 40 Treffer
- geoscience 38 Treffer
- nuclear engineering 35 Treffer
- copper 33 Treffer
- packaging 33 Treffer
- testing 31 Treffer
- assembly 30 Treffer
- fatigue 30 Treffer
- substrates 30 Treffer
- strain 29 Treffer
- temperature measurement 27 Treffer
- electronic packaging thermal management 26 Treffer
- thermomechanical processes 25 Treffer
- genetic algorithms 24 Treffer
- temperature 24 Treffer
- inspection 23 Treffer
- stress 23 Treffer
- predictive models 21 Treffer
- environmentally friendly manufacturing techniques 19 Treffer
- optimization 19 Treffer
- aging 17 Treffer
- silicon 17 Treffer
- thermal stresses 17 Treffer
- computational modeling 16 Treffer
- conferences 16 Treffer
- electric shock 16 Treffer
- thermal resistance 16 Treffer
- intermetallic 15 Treffer
- analytical models 14 Treffer
- ball grid array (bga) 14 Treffer
- capacitive sensors 14 Treffer
- finite element analysis 14 Treffer
- plastics 14 Treffer
Verlag
- ieee 351 Treffer
- japan institute of electronics packaging 17 Treffer
- imaps-europe 9 Treffer
- ieee components, packaging, and manufacturing technology society and the ieee tab steering committee 6 Treffer
- smta 4 Treffer
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8 weitere Werte:
- the japan institute of electronics packaging 2 Treffer
- department of microelectronics and computer science, lodz university of technology 1 Treffer
- emc europe foundation 1 Treffer
- epe association 1 Treffer
- european microwave association 1 Treffer
- jiep 1 Treffer
- john wiley & sons 1 Treffer
- wiley 1 Treffer
Publikation
- ieee transactions on electronics packaging manufacturing, electronics packaging manufacturing, ieee transactions on, ieee trans. electron. packag. manufact. 24 Treffer
- ieee access, access, ieee 15 Treffer
- ieee transactions on device and materials reliability, device and materials reliability, ieee transactions on, ieee trans. device mater. relib. 13 Treffer
- 2009 11th electronics packaging technology conference, electronics packaging technology conference, 2009. eptc '09. 11th 12 Treffer
- 2019 18th ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm), thermal and thermomechanical phenomena in electronic systems (itherm), 2019 18th ieee intersociety conference on 12 Treffer
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45 weitere Werte:
- 2012 ieee 14th electronics packaging technology conference (eptc), electronics packaging technology conference (eptc), 2012 ieee 14th 8 Treffer
- 2017 16th ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm), thermal and thermomechanical phenomena in electronic systems (itherm), 2017 16th ieee intersociety conference on 8 Treffer
- 2018 17th ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm), thermal and thermomechanical phenomena in electronic systems (itherm), 2018 17th ieee intersociety conference on 8 Treffer
- 2019 22nd european microelectronics and packaging conference & exhibition (empc), european microelectronics and packaging conference & exhibition (empc), 2019 22nd 8 Treffer
- 3rd electronics system integration technology conference estc, electronic system-integration technology conference (estc), 2010 3rd 8 Treffer
- 2012 14th international conference on electronic materials and packaging (emap), electronic materials and packaging (emap), 2012 14th international conference on 7 Treffer
- 2020 19th ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm), thermal and thermomechanical phenomena in electronic systems (itherm), 2020 19th ieee intersociety conference on 7 Treffer
- 2022 21st ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm), thermal and thermomechanical phenomena in electronic systems (itherm), 2022 21st ieee intersociety conference on 7 Treffer
- ieee transactions on components, packaging, and manufacturing technology: part b, components, packaging, and manufacturing technology, part b: advanced packaging, ieee transactions on, ieee trans. comp., packag., manufact. technol. b 7 Treffer
- 13th intersociety conference on thermal and thermomechanical phenomena in electronic systems, thermal and thermomechanical phenomena in electronic systems (itherm), 2012 13th ieee intersociety conference on 6 Treffer
- 2010 34th ieee/cpmt international electronic manufacturing technology symposium (iemt), electronic manufacturing technology symposium (iemt), 2010 34th ieee/cpmt international 6 Treffer
- ieee transactions on components, packaging, and manufacturing technology: part c, components, packaging, and manufacturing technology, part c, ieee transactions on, ieee trans. comp., packag., manufact. technol. c 6 Treffer
- 2012 35th ieee/cpmt international electronics manufacturing technology conference (iemt), electronic manufacturing technology symposium (iemt), 2012 35th ieee/cpmt international 5 Treffer
- 2021 ieee 23rd electronics packaging technology conference (eptc), electronics packaging technology conference (eptc), 2021 ieee 23rd 5 Treffer
- 2010 11th international thermal, mechanical & multi-physics simulation, and experiments in microelectronics and microsystems (eurosime), thermal, mechanical & multi-physics simulation, and experiments in microelectronics and microsystems (eurosime), 2010 11th international conference on 4 Treffer
- 2017 international conference on electronics packaging (icep), electronics packaging (icep), 2017 international conference on 4 Treffer
- 2018 international conference on electronics packaging and imaps all asia conference (icep-iaac), electronics packaging and imaps all asia conference (icep-iaac), 2018 international conference on 4 Treffer
- 2022 ieee 39th international electronics manufacturing technology conference (iemt), electronics manufacturing technology conference (iemt), 2022 ieee 39th international 4 Treffer
- 2024 international conference on electronics packaging (icep), electronics packaging (icep), 2024 international conference on 4 Treffer
- ieee transactions on components, packaging, and manufacturing technology: part a, components, packaging, and manufacturing technology, part a, ieee transactions on, ieee trans. comp., packag., manufact. technol. a 4 Treffer
- ieee transactions on industrial electronics, industrial electronics, ieee transactions on, ieee trans. ind. electron. 4 Treffer
- 2010 12th ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems, thermal and thermomechanical phenomena in electronic systems (itherm), 2010 12th ieee intersociety conference on 3 Treffer
- 33rd international spring seminar on electronics technology, isse 2010, electronics technology (isse), 2010 33rd international spring seminar on 3 Treffer
- fourteenth intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm), thermal and thermomechanical phenomena in electronic systems (itherm), 2014 ieee intersociety conference on 3 Treffer
- 2004 ieee region 10 conference tencon 2004., tencon 2004. 2004 ieee region 10 conference, tencon 2004 2 Treffer
- 2010 ieee 16th international symposium for design and technology in electronic packaging (siitme), design and technology in electronic packaging (siitme), 2010 ieee 16th international symposium for 2 Treffer
- 2010 ieee electrical design of advanced package & systems symposium, electrical design of advanced packaging & systems symposium (edaps), 2010 ieee 2 Treffer
- 2011 12th intl. conf. on thermal, mechanical & multi-physics simulation and experiments in microelectronics and microsystems, thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2011 12th international conference on 2 Treffer
- 2011 27th annual ieee semiconductor thermal measurement and management symposium, semiconductor thermal measurement and management symposium (semi-therm), 2011 27th annual ieee 2 Treffer
- 2011 ieee gcc conference and exhibition (gcc), gcc conference and exhibition (gcc), 2011 ieee 2 Treffer
- 2011 international conference on quality, reliability, risk, maintenance, and safety engineering, quality, reliability, risk, maintenance, and safety engineering (icqr2mse), 2011 international conference on 2 Treffer
- 2012 19th ieee international symposium on the physical and failure analysis of integrated circuits, physical and failure analysis of integrated circuits (ipfa), 2012 19th ieee international symposium on the 2 Treffer
- 2012 ieee electrical design of advanced packaging and systems symposium (edaps), electrical design of advanced packaging and systems symposium (edaps), 2012 ieee 2 Treffer
- 2013 14th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2013 14th international conference on 2 Treffer
- 2013 8th eurosim congress on modelling and simulation, modelling and simulation (eurosim), 2013 8th eurosim congress on 2 Treffer
- 2016 international conference on electronics packaging (icep), electronics packaging (icep), 2016 international conference on 2 Treffer
- 2018 ieee electrical design of advanced packaging and systems symposium (edaps), electrical design of advanced packaging and systems symposium (edaps), 2018 ieee 2 Treffer
- 2019 42nd international spring seminar on electronics technology (isse), electronics technology (isse), 2019 42nd international spring seminar on 2 Treffer
- 2019 ieee nuclear science symposium and medical imaging conference (nss/mic), nuclear science symposium and medical imaging conference (nss/mic), 2019 ieee 2 Treffer
- 2019 ieee pes innovative smart grid technologies europe (isgt-europe), innovative smart grid technologies europe (isgt-europe), 2019 ieee pes 2 Treffer
- 2019 international conference on electronics packaging (icep), electronics packaging (icep), 2019 international conference on 2 Treffer
- 2019 pan pacific microelectronics symposium (pan pacific), microelectronics symposium (pan pacific), 2019 pan pacific 2 Treffer
- 2021 22nd international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2021 22nd international conference on 2 Treffer
- 2021 international conference on electronics packaging (icep), electronics packaging (icep), 2021 international conference on 2 Treffer
- 2023 22nd ieee intersociety conference on thermal and thermomechanical phenomena in electronic systems (itherm), thermal and thermomechanical phenomena in electronic systems (itherm), 2023 22nd ieee intersociety conference on 2 Treffer
Inhaltsanbieter
395 Treffer
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In: 2024 International Conference on Electronics Packaging (ICEP), 2024-04-17, S. 1-2Online KonferenzZugriff:
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In: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023-05-30, S. 1-8Online KonferenzZugriff:
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In: 2023 International Conference on Advances in Electrical Engineering and Computer Applications (AEECA), 2023-08-18, S. 547-552Online KonferenzZugriff:
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In: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2023-12-12, S. 1-3Online KonferenzZugriff:
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In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022-05-31, S. 1-6Online KonferenzZugriff:
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In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022-05-31, S. 1-9Online KonferenzZugriff:
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In: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2021-09-13, S. 1-8Online KonferenzZugriff:
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In: 2020 7th International Conference on Information Science and Control Engineering (ICISCE), 2020-12-01, S. 144-147Online KonferenzZugriff:
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In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020-07-01, S. 1201-1210Online KonferenzZugriff:
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In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020-07-01, S. 1035-1042Online KonferenzZugriff:
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In: 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT), 2022-10-19, S. 1-6Online KonferenzZugriff:
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In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022-05-31, S. 1-5Online KonferenzZugriff:
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In: IEEE Journal of Emerging and Selected Topics in Power Electronics, Jg. 10 (2022-10-01), Heft 5, S. 6171-6179Online academicJournalZugriff:
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In: 2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE, 2020-09-23, S. 1-6Online KonferenzZugriff:
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In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019-09-01, S. 1-5Online KonferenzZugriff:
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In: 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2022-08-01, S. 641-641Online KonferenzZugriff:
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In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019-09-01, S. 1-7Online KonferenzZugriff:
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In: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 2021-12-07, S. 176-183Online KonferenzZugriff:
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In: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 2021-12-07, S. 589-593Online KonferenzZugriff:
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In: 2019 International Conference on Electronics Packaging (ICEP), 2019-04-01, S. 235-239Online KonferenzZugriff: