Suchergebnisse
Katalog
Artikel & mehr
Suchmaske
Suchergebnisse einschränken oder erweitern
Aktive Suchfilter
Weniger Treffer
Art der Quelle
Thema
- components, circuits, devices and systems 94 Treffer
- soldering 72 Treffer
- engineered materials, dielectrics and plasmas 50 Treffer
- reliability 49 Treffer
- lead 45 Treffer
-
45 weitere Werte:
- solder & soldering 42 Treffer
- aging 33 Treffer
- photonics and electrooptics 32 Treffer
- temperature 28 Treffer
- environmentally friendly manufacturing techniques 22 Treffer
- ball grid array technology 21 Treffer
- intermetallic 21 Treffer
- testing 20 Treffer
- tin 20 Treffer
- fatigue 19 Treffer
- shear strength 19 Treffer
- gold 18 Treffer
- intermetallic compounds 18 Treffer
- solder 18 Treffer
- isothermal aging 16 Treffer
- isothermal processes 16 Treffer
- solder joints 16 Treffer
- electronics packaging 15 Treffer
- assembly 14 Treffer
- electronic packaging 14 Treffer
- lead-free 14 Treffer
- nickel 14 Treffer
- signal processing and analysis 14 Treffer
- snagcu 14 Treffer
- thermal cycling 14 Treffer
- failure analysis 13 Treffer
- lead-free solder 13 Treffer
- power, energy and industry applications 13 Treffer
- joints 12 Treffer
- metals 12 Treffer
- packaging 12 Treffer
- temperature measurement 12 Treffer
- copper 11 Treffer
- mechanical factors 11 Treffer
- substrates 11 Treffer
- communication, networking and broadcast technologies 10 Treffer
- interfacial reaction 10 Treffer
- computing and processing 9 Treffer
- creep 9 Treffer
- stress 9 Treffer
- surface finishing 9 Treffer
- tin alloys 9 Treffer
- morphology 8 Treffer
- solder joint 8 Treffer
- copper alloys 7 Treffer
Verlag
- ieee 108 Treffer
- elsevier b.v. 28 Treffer
- springer nature 24 Treffer
- elsevier 6 Treffer
- emerald publishing limited 6 Treffer
-
17 weitere Werte:
- springer us 6 Treffer
- hal ccsd 5 Treffer
- japan institute of electronics packaging 5 Treffer
- mdpi 4 Treffer
- american institute of physics 2 Treffer
- br publishing 2 Treffer
- institute of electrical and electronics engineers (ieee) 2 Treffer
- mdpi ag 2 Treffer
- taylor & francis 2 Treffer
- american society of mechanical engineers 1 Treffer
- electronic components & materials 1 Treffer
- elsevier� 1 Treffer
- institute of electrical and electronics engineers 1 Treffer
- multidisciplinary digital publishing institute 1 Treffer
- sandia national laboratories 1 Treffer
- smta 1 Treffer
- springer-verlag 1 Treffer
Publikation
- journal of electronic materials 19 Treffer
- ieee transactions on components, packaging & manufacturing technology 8 Treffer
- journal of alloys & compounds 8 Treffer
- microelectronics reliability 8 Treffer
- journal of materials science: materials in electronics 7 Treffer
-
45 weitere Werte:
- soldering & surface mount technology 6 Treffer
- ieee transactions on advanced packaging 4 Treffer
- ieee transactions on components, packaging and manufacturing technology, components, packaging and manufacturing technology, ieee transactions on, ieee trans. compon., packag. manufact. technol. 4 Treffer
- 2007 proceedings 57th electronic components and technology conference, electronic components and technology conference, 2007. ectc '07. proceedings. 57th 3 Treffer
- 2012 ieee 62nd electronic components & technology conference 3 Treffer
- 2012 ieee 62nd electronic components and technology conference, electronic components and technology conference (ectc), 2012 ieee 62nd 3 Treffer
- 2014 15th international conference on electronic packaging technology, electronic packaging technology (icept), 2014 15th international conference on 3 Treffer
- 2016 17th international conference on electronic packaging technology (icept), electronic packaging technology (icept), 2016 17th international conference on 3 Treffer
- 2017 18th international conference on electronic packaging technology (icept), electronic packaging technology (icept), 2017 18th international conference on 3 Treffer
- 2021 22nd international conference on electronic packaging technology (icept), electronic packaging technology (icept), 2021 22nd international conference on 3 Treffer
- 56th electronic components and technology conference 2006, electronic components and technology conference, 2006. proceedings. 56th, electronic components & technology 3 Treffer
- 2001 proceedings. 51st electronic components and technology conference (cat. no.01ch37220), electronic components and technology conference, 2001. proceedings., 51st, electronic components and technology 2 Treffer
- 2009 11th electronics packaging technology conference, electronics packaging technology conference, 2009. eptc '09. 11th 2 Treffer
- 2009 59th electronic components and technology conference, electronic components and technology conference, 2009. ectc 2009. 59th 2 Treffer
- 2010 proceedings 60th electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2010 proceedings 60th 2 Treffer
- 2011 ieee 61st electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2011 ieee 61st 2 Treffer
- 2013 ieee 63rd electronic components and technology conference, electronic components and technology conference (ectc), 2013 ieee 63rd 2 Treffer
- 2014 ieee 64th electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2014 ieee 64th 2 Treffer
- 2015 16th international conference on electronic packaging technology (icept), electronic packaging technology (icept), 2015 16th international conference on 2 Treffer
- 2017 international conference on electronics packaging (icep), electronics packaging (icep), 2017 international conference on 2 Treffer
- 2018 ieee 20th electronics packaging technology conference (eptc), electronics packaging technology conference (eptc), 2018 ieee 20th 2 Treffer
- 2018 ieee 68th electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2018 ieee 68th, ectc 2 Treffer
- 2019 international conference on electronics packaging (icep), electronics packaging (icep), 2019 international conference on 2 Treffer
- 52nd electronic components and technology conference 2002. (cat. no.02ch37345), electronic components and technology conference, 2002. proceedings. 52nd, electronic components and technology conference 2 Treffer
- aip conference proceedings 2 Treffer
- gold bulletin 2 Treffer
- ieee transactions on electronics packaging manufacturing, electronics packaging manufacturing, ieee transactions on, ieee trans. electron. packag. manufact. 2 Treffer
- international journal of fracture 2 Treffer
- issn: 0026-2714 2 Treffer
- issn: 0950-0839 2 Treffer
- materials (1996-1944) 2 Treffer
- materials science & engineering: b 2 Treffer
- microelectronic engineering 2 Treffer
- proceedings of the sixth ieee cpmt conference on high density microsystem design and packaging and component failure analysis (hdp '04), high density microsystem design and packaging and component failure analysis, 2004. hdp '04. proceeding of the sixth ieee cpmt conference on, high density microsystem design and packaging and component failure analysis 2 Treffer
- smt: surface mount technology 2 Treffer
- 18th european microelectronics & packaging conference, microelectronics and packaging conference (empc), 2011 18th european 1 Treffer
- 2002 proceedings. 8th international advanced packaging materials symposium (cat. no.02th8617), advanced packaging materials, 2002. proceedings. 2002 8th international symposium on, advanced packaging materials symposium 1 Treffer
- 2006 international conference on electronic materials and packaging, electronic materials and packaging, 2006. emap 2006. international conference on 1 Treffer
- 2007 32nd ieee/cpmt international electronic manufacturing technology symposium, electronic manufacturing technology symposium, 2007. iemt '07. 32nd ieee/cpmt international 1 Treffer
- 2007 8th international conference on electronic packaging technology, electronic packaging technology, 2007. icept 2007. 8th international conference on 1 Treffer
- 2007 9th electronics packaging technology conference, electronics packaging technology conference, 2007. eptc 2007. 9th 1 Treffer
- case studies in construction materials 1 Treffer
- journal of electronic packaging 1 Treffer
- journal of materials research and technology 1 Treffer
- metals 1 Treffer
Sprache
Geographischer Bezug
Inhaltsanbieter
211 Treffer
-
In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 14 (2024-03-01), Heft 3, S. 406-416Online academicJournalZugriff:
-
In: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020-07-01, S. 1201-1210Online KonferenzZugriff:
-
In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022-08-10, S. 1-5Online KonferenzZugriff:
-
In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020-06-01, S. 1894-1903Online KonferenzZugriff:
-
In: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021-09-14, S. 1-4Online KonferenzZugriff:
-
In: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019-05-01, S. 306-313Online KonferenzZugriff:
-
In: 2019 International Conference on Electronics Packaging (ICEP), 2019-04-01, S. 235-239Online KonferenzZugriff:
-
In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017-08-01, S. 1649-1654Online KonferenzZugriff:
-
In: 2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017-08-01, S. 1258-1261Online KonferenzZugriff:
-
In: 2016 17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-01, S. 1010-1014Online KonferenzZugriff:
-
In: 2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015-08-01, S. 307-311Online KonferenzZugriff:
-
In: 2014 15th International Conference on Electronic Packaging Technology, 2014-05-01, S. 587-591Online KonferenzZugriff:
-
In: 2013 14th International Conference on Electronic Packaging Technology, 2013-08-01, S. 694-697Online KonferenzZugriff:
-
In: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018-05-01, S. 882-889Online KonferenzZugriff:
-
In: 2012 IEEE 62nd Electronic Components and Technology Conference, 2012-05-01, S. 469-476Online KonferenzZugriff:
-
In: 2016 17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-01, S. 968-973Online KonferenzZugriff:
-
In: 2017 International Conference on Electronics Packaging (ICEP), 2017-04-01, S. 232-236Online KonferenzZugriff:
-
In: IEEE Transactions on Advanced Packaging, Jg. 28 (2005-05-01), Heft 2, S. 252-258Online academicJournalZugriff:
-
In: IEEE Transactions on Device and Materials Reliability, Jg. 8 (2008-03-01), Heft 1, S. 160-167Online academicJournalZugriff:
-
In: 2008 10th Electronics Packaging Technology Conference, 2008-12-01, S. 588Online KonferenzZugriff: