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Weniger Treffer
Art der Quelle
Thema
- computing and processing 13 Treffer
- communication, networking and broadcast technologies 12 Treffer
- engineered materials, dielectrics and plasmas 8 Treffer
- fields, waves and electromagnetics 7 Treffer
- signal processing and analysis 7 Treffer
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45 weitere Werte:
- silicon germanium 7 Treffer
- power amplifiers 6 Treffer
- radio frequency 6 Treffer
- power, energy and industry applications 5 Treffer
- packaging 4 Treffer
- bioengineering 3 Treffer
- cmos integrated circuits 3 Treffer
- germanium silicon alloys 3 Treffer
- photonics and electrooptics 3 Treffer
- 802.11n 2 Treffer
- accuracy 2 Treffer
- acoustics 2 Treffer
- bandwidth 2 Treffer
- bicmos integrated circuits 2 Treffer
- cmos technology 2 Treffer
- costs 2 Treffer
- electrical resistance measurement 2 Treffer
- engineering profession 2 Treffer
- envelope tracking (et) 2 Treffer
- etching 2 Treffer
- frequency measurement 2 Treffer
- general topics for engineers 2 Treffer
- heterojunction bipolar transistors 2 Treffer
- impedance 2 Treffer
- inductance 2 Treffer
- inductance measurement 2 Treffer
- linearity 2 Treffer
- lte 2 Treffer
- micromechanical devices 2 Treffer
- mimo 2 Treffer
- modulation 2 Treffer
- ofdm 2 Treffer
- robotics and control systems 2 Treffer
- sige 2 Treffer
- speech 2 Treffer
- task analysis 2 Treffer
- transportation 2 Treffer
- wireless lan 2 Treffer
- wlan 2 Treffer
- 3d 1 Treffer
- adaptive filter 1 Treffer
- adaptive optics 1 Treffer
- aerospace 1 Treffer
- atmosphere 1 Treffer
- atmospheric measurements 1 Treffer
Verlag
Publikation
- 2006 8th electronics packaging technology conference, electronics packaging technology conference, 2006. eptc '06. 8th 1 Treffer
- 2008 ieee 21st international conference on micro electro mechanical systems, micro electro mechanical systems, 2008. mems 2008. ieee 21st international conference on 1 Treffer
- 2008 ieee radio frequency integrated circuits symposium, radio frequency integrated circuits symposium, 2008. rfic 2008. ieee 1 Treffer
- 2010 11th international conference on electronic packaging technology & high density packaging, electronic packaging technology & high density packaging (icept-hdp), 2010 11th international conference on 1 Treffer
- 2010 international conference on microelectronic test structures (icmts), microelectronic test structures (icmts), 2010 ieee international conference on 1 Treffer
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18 weitere Werte:
- 2011 ieee 54th international midwest symposium on circuits and systems (mwscas), circuits and systems (mwscas), 2011 ieee 54th international midwest symposium on 1 Treffer
- 2012 ieee 12th topical meeting on silicon monolithic integrated circuits in rf systems, silicon monolithic integrated circuits in rf systems (sirf), 2012 ieee 12th topical meeting on 1 Treffer
- 2012 ieee bipolar/bicmos circuits and technology meeting (bctm), bipolar/bicmos circuits and technology meeting (bctm), 2012 ieee 1 Treffer
- 2012 ieee workshop on microelectronics and electron devices, microelectronics and electron devices (wmed), 2012 ieee workshop on 1 Treffer
- 2013 ieee international conference on microelectronic test structures (icmts), microelectronic test structures (icmts), 2013 ieee international conference on 1 Treffer
- 2013 ieee international conference on signal processing, communication and computing (icspcc 2013), signal processing, communication and computing (icspcc), 2013 ieee international conference on 1 Treffer
- 2013 ieee topical conference on power amplifiers for wireless and radio applications, power amplifiers for wireless and radio applications (pawr), 2013 ieee topical conference on 1 Treffer
- 2015 38th international conference on telecommunications and signal processing (tsp), telecommunications and signal processing (tsp), 2015 38th international conference on 1 Treffer
- 2021 ieee 71st electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2021 ieee 71st, ectc 1 Treffer
- 2022 ieee 8th all-russian microwave conference (rmc), microwave conference (rmc), 2022 ieee 8th all-russian 1 Treffer
- 2022 ieee electrical design of advanced packaging and systems (edaps), advanced packaging and systems (edaps), 2022 ieee electrical design of 1 Treffer
- canadian journal of electrical and computer engineering, electrical and computer engineering, canadian journal of, can. j. electr. comput. eng. 1 Treffer
- cas 2011 proceedings (2011 international semiconductor conference), semiconductor conference (cas), 2011 international 1 Treffer
- ieee access, access, ieee 1 Treffer
- ieee instrumentation & measurement magazine, instrumentation & measurement magazine, ieee, ieee instrum. meas. mag. 1 Treffer
- ieee journal of solid-state circuits, solid-state circuits, ieee journal of, ieee j. solid-state circuits 1 Treffer
- ieee transactions on biomedical engineering, biomedical engineering, ieee transactions on, ieee trans. biomed. eng. 1 Treffer
- proceedings of technical program of 2012 vlsi design, automation and test, vlsi design, automation, and test (vlsi-dat), 2012 international symposium on 1 Treffer
Inhaltsanbieter
23 Treffer
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In: IEEE Access, Jg. 10 (2022), S. 34789-34799academicJournalZugriff:
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In: IEEE Transactions on Biomedical Engineering, Jg. 66 (2019-06-01), Heft 6, S. 1730-1741Online academicJournalZugriff:
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In: Canadian Journal of Electrical and Computer Engineering, Jg. 42 (2019-12-15), Heft 1, S. 20-26Online academicJournalZugriff:
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In: 2012 IEEE Workshop on Microelectronics and Electron Devices, 2012-04-01, S. 1-4Online KonferenzZugriff:
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In: 2011 IEEE 54th International Midwest Symposium on Circuits and Systems (MWSCAS), 2011-08-01, S. 1-4Online KonferenzZugriff:
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In: 2013 IEEE International Conference on Microelectronic Test Structures (ICMTS), 2013-03-01, S. 33-36Online KonferenzZugriff:
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In: 2022 IEEE 8th All-Russian Microwave Conference (RMC), 2022-11-23, S. 370-375Online KonferenzZugriff:
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In: 2013 IEEE International Conference on Signal Processing, Communication and Computing (ICSPCC 2013), 2013-08-01, S. 1-5Online KonferenzZugriff:
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In: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2022-12-12, S. 1-3Online KonferenzZugriff:
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In: 2010 11th International Conference on Electronic Packaging Technology & High Density, 2010-08-01, S. 530-533Online KonferenzZugriff:
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In: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021-06-01, S. 507-513Online KonferenzZugriff:
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In: 2006 8th Electronics Packaging Technology Conference, 2006-12-01, S. 441Online KonferenzZugriff:
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In: 2015 38th International Conference on Telecommunications and Signal Processing (TSP), 2015-07-01, S. 1-5Online KonferenzZugriff:
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In: 2012 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2012-09-01, S. 1-4Online KonferenzZugriff:
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In: Proceedings of Technical Program of 2012 VLSI Design, Automation and Test, 2012-04-01, S. 1-4Online KonferenzZugriff:
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In: 2012 IEEE 12th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2012, S. 69-72Online KonferenzZugriff:
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In: CAS 2011 Proceedings (2011 International Semiconductor Conference), Jg. 1 (2011-10-01), S. 163-166Online KonferenzZugriff:
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In: 2010 International Conference on Microelectronic Test Structures (ICMTS), 2010-03-01, S. 136-139Online KonferenzZugriff:
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In: 2013 IEEE Topical Conference on Power Amplifiers for Wireless and Radio Applications, 2013, S. 22-24Online KonferenzZugriff:
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In: IEEE Journal of Solid-State Circuits, Jg. 44 (2009-05-01), Heft 5, S. 1361-1371Online academicJournalZugriff: