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Weniger Treffer
Art der Quelle
Thema
- components, circuits, devices and systems 380 Treffer
- engineered materials, dielectrics and plasmas 264 Treffer
- electronics packaging 167 Treffer
- soldering 143 Treffer
- photonics and electrooptics 105 Treffer
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45 weitere Werte:
- lead 100 Treffer
- testing 97 Treffer
- packaging 89 Treffer
- chip scale packaging 74 Treffer
- costs 65 Treffer
- environmentally friendly manufacturing techniques 63 Treffer
- temperature 63 Treffer
- flip chip 56 Treffer
- electronic packaging thermal management 50 Treffer
- computing and processing 47 Treffer
- thermal stresses 44 Treffer
- bonding 42 Treffer
- fatigue 41 Treffer
- failure analysis 38 Treffer
- general topics for engineers 37 Treffer
- reliability 37 Treffer
- copper 34 Treffer
- capacitive sensors 33 Treffer
- printed circuits 33 Treffer
- stress 33 Treffer
- surface-mount technology 33 Treffer
- ceramics 31 Treffer
- signal processing and analysis 31 Treffer
- silicon 31 Treffer
- substrates 31 Treffer
- integrated circuit packaging 30 Treffer
- plastic packaging 30 Treffer
- power, energy and industry applications 30 Treffer
- finite element methods 29 Treffer
- fields, waves and electromagnetics 28 Treffer
- predictive models 28 Treffer
- manufacturing processes 27 Treffer
- materials reliability 27 Treffer
- semiconductor device packaging 26 Treffer
- gold 23 Treffer
- tin 23 Treffer
- electric shock 22 Treffer
- life estimation 22 Treffer
- packaging machines 22 Treffer
- wire 20 Treffer
- electronics industry 19 Treffer
- manufacturing 19 Treffer
- routing 19 Treffer
- circuit testing 18 Treffer
- communication, networking and broadcast technologies 18 Treffer
Verlag
Publikation
- ieee transactions on electronics packaging manufacturing, electronics packaging manufacturing, ieee transactions on, ieee trans. electron. packag. manufact. 13 Treffer
- 2010 proceedings 60th electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2010 proceedings 60th 10 Treffer
- proceedings electronic components and technology, 2005. ectc '05., electronic components and technology conference, 2005. proceedings. 55th, electronic components and technology 10 Treffer
- 56th electronic components and technology conference 2006, electronic components and technology conference, 2006. proceedings. 56th, electronic components & technology 9 Treffer
- ieee transactions on advanced packaging, advanced packaging, ieee transactions on, ieee trans. adv. packag. 9 Treffer
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45 weitere Werte:
- 1998 proceedings. 48th electronic components and technology conference (cat. no.98ch36206), electronic components & technology conference, 1998. 48th ieee, electronic components and technology 8 Treffer
- 2007 proceedings 57th electronic components and technology conference, electronic components and technology conference, 2007. ectc '07. proceedings. 57th 8 Treffer
- 2008 10th electronics packaging technology conference, electronics packaging technology conference, 2008. eptc 2008. 10th 8 Treffer
- 2008 58th electronic components and technology conference, electronic components and technology conference, 2008. ectc 2008. 58th 8 Treffer
- ieee transactions on components and packaging technologies, components and packaging technologies, ieee transactions on, ieee trans. comp. packag. technol. 8 Treffer
- ieee transactions on components, packaging & manufacturing technology 8 Treffer
- 1999 proceedings. 49th electronic components and technology conference (cat. no.99ch36299), electronic components and technology conference, 1999. 1999 proceedings. 49th, electronic components and technology 7 Treffer
- 2007 8th international conference on electronic packaging technology, electronic packaging technology, 2007. icept 2007. 8th international conference on 7 Treffer
- 2000 proceedings. 50th electronic components and technology conference (cat. no.00ch37070), electronic components & technology conference, 2000. 2000 proceedings. 50th, electronic components and technology 6 Treffer
- 2004 proceedings. 54th electronic components and technology conference (ieee cat. no.04ch37546), electronic components and technology conference, 2004. proceedings. 54th, electronic components and technology 6 Treffer
- 2006 7th international conference on electronic packaging technology, electronic packaging technology, 2006. icept '06. 7th international conference on 6 Treffer
- 2009 59th electronic components and technology conference, electronic components and technology conference, 2009. ectc 2009. 59th 6 Treffer
- 2009 international conference on electronic packaging technology & high density packaging, electronic packaging technology & high density packaging, 2009. icept-hdp '09. international conference on 6 Treffer
- 2013 ieee 63rd electronic components and technology conference, electronic components and technology conference (ectc), 2013 ieee 63rd 6 Treffer
- twenty first ieee/cpmt international electronics manufacturing technology symposium proceedings 1997 iemt symposium, electronics manufacturing technology symposium, 1997., twenty-first ieee/cpmt international, electronics manufacturing technology 6 Treffer
- twenty sixth ieee/cpmt international electronics manufacturing technology symposium (cat. no.00ch37146), electronics manufacturing technology symposium, 2000. twenty-sixth ieee/cpmt international, electronics manufacturing technology 6 Treffer
- 2001 proceedings. 51st electronic components and technology conference (cat. no.01ch37220), electronic components and technology conference, 2001. proceedings., 51st, electronic components and technology 5 Treffer
- 52nd electronic components and technology conference 2002. (cat. no.02ch37345), electronic components and technology conference, 2002. proceedings. 52nd, electronic components and technology conference 5 Treffer
- proceedings. 1998 international conference on multichip modules and high density packaging (cat. no.98ex154), multichip modules and high density packaging, 1998. proceedings. 1998 international conference on, multichip modules and high density packaging 5 Treffer
- 1995 proceedings. 45th electronic components and technology conference, electronic components and technology conference, 1995. proceedings., 45th, electronic components and technology 4 Treffer
- 1996 proceedings 46th electronic components and technology conference, electronic components and technology conference, 1996. proceedings., 46th, electronic components and technology 4 Treffer
- 1997 proceedings 47th electronic components and technology conference, electronic components and technology conference, 1997. proceedings., 47th, electronic components and technology 4 Treffer
- 2005 6th international conference on electronic packaging technology, electronic packaging technology, 2005 6th international conference on, electronics packaging technology 4 Treffer
- 2006 international conference on electronic materials and packaging, electronic materials and packaging, 2006. emap 2006. international conference on 4 Treffer
- 2008 33rd ieee/cpmt international electronics manufacturing technology conference (iemt), electronic manufacturing technology symposium (iemt), 2008 33rd ieee/cpmt international 4 Treffer
- 2008 3rd international microsystems, packaging, assembly & circuits technology conference, microsystems, packaging, assembly & circuits technology conference, 2008. impact 2008. 3rd international 4 Treffer
- 2010 12th electronics packaging technology conference, electronics packaging technology conference (eptc), 2010 12th 4 Treffer
- 2014 ieee 64th electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2014 ieee 64th 4 Treffer
- 53rd electronic components and technology conference, 2003. proceedings., electronic components and technology conference, 2003. proceedings. 53rd 4 Treffer
- ieee transactions on advanced packaging 4 Treffer
- international symposium on electronic materials and packaging (emap2000) (cat. no.00ex458), electronic materials and packaging, 2000. (emap 2000). international symposium on, electronic materials and packaging 4 Treffer
- foundations of heterogeneous integration: an industry-based, 2.5d/3d pathfinding and co-design approach 3 Treffer
- 2012 ieee 62nd electronic components & technology conference 2 Treffer
- icept 2003 - 5th international conference on electronic packaging technology, proceedings 2 Treffer
- 13th intersociety conference on thermal & thermomechanical phenomena in electronic systems 1 Treffer
- 18th european microelectronics & packaging conference 1 Treffer
- 2011 ieee 13th electronics packaging technology conference 1 Treffer
- 2012 13th international conference on electronic packaging technology & high density packaging 1 Treffer
- 46th international symposium on microelectronics, imaps 2013 1 Treffer
- ieee transactions on electronics packaging manufacturing 1 Treffer
- journal of materials science & technology 1 Treffer
- nanopackaging: nanotechnologies and electronics packaging, second edition 1 Treffer
- proceedings of the electronic packaging technology conference, eptc 1 Treffer
- proceedings of the international symposium on the physical and failure analysis of integrated circuits, ipfa 1 Treffer
- soldering & surface mount technology 1 Treffer
Sprache
Inhaltsanbieter
434 Treffer
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In: 2015 IEEE Conference on Prognostics and Health Management (PHM), 2015-06-01, S. 1-14Online KonferenzZugriff:
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In: 2014 15th International Conference on Electronic Packaging Technology, 2014-05-01, S. 1083-1095Online KonferenzZugriff:
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In: 2012 13th International Conference on Electronic Packaging Technology & High Density, 2012-08-01, S. 1216-1221Online KonferenzZugriff:
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In: 2011 12th International Conference on Electronic Packaging Technology and High Density, 2011-08-01, S. 1-5Online KonferenzZugriff:
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In: 2005 6th International Conference on Electronic Packaging Technology, 2005, S. 1-6Online KonferenzZugriff:
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In: IEEE Transactions on Components, Packaging and Manufacturing Technology, Jg. 2 (2012-08-01), Heft 8, S. 1329-1334Online academicJournalZugriff:
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In: 2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015-10-01, S. 300-303Online KonferenzZugriff:
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In: IEEE Transactions on Device and Materials Reliability, Jg. 8 (2008-09-01), Heft 3, S. 449-454Online academicJournalZugriff:
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In: IEEE Transactions on Electronics Packaging Manufacturing, Jg. 31 (2008-07-01), Heft 3, S. 240-247Online academicJournalZugriff:
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In: IEEE Transactions on Electronics Packaging Manufacturing, Jg. 30 (2007-10-01), Heft 4, S. 270-278Online academicJournalZugriff:
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In: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015-05-01, S. 2048-2053Online KonferenzZugriff:
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In: Proceedings of the 5th Electronics System-integration Technology Conference (ESTC), 2014-09-01, S. 1-6Online KonferenzZugriff:
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In: IEEE Transactions on Advanced Packaging, Jg. 29 (2006-05-01), Heft 2, S. 232-239Online academicJournalZugriff:
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In: IEEE Transactions on Device and Materials Reliability, Jg. 8 (2008-03-01), Heft 1, S. 160-167Online academicJournalZugriff:
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In: 2007 IEEE/MTT-S International Microwave Symposium, 2007-06-01, S. 1637Online KonferenzZugriff:
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In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014-05-01, S. 395-403Online KonferenzZugriff:
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In: 2014 IEEE Aerospace Conference, 2014-03-01, S. 1-9Online KonferenzZugriff:
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In: 2006 7th International Conference on Electronic Packaging Technology, 2006-08-01, S. 1Online KonferenzZugriff:
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In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014-05-01, S. 365-370Online KonferenzZugriff:
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In: 2013 IEEE Aerospace Conference, 2013-03-01, S. 1-8Online KonferenzZugriff: